Key Points
- India’s first 3D chip packaging unit launched in Bhubaneswar with ₹2,000 crore investment
- Facility to produce 70,000 glass panels and 50 million assembled units annually
- India became world’s largest mobile phone exporter in 2025
India‘s first advanced 3D chip packaging facility will come up in Bhubaneswar after the foundation stone was laid on Sunday at Info Valley. The ₹2,000 crore project by 3D Glass Solutions marks Odisha’s entry into high-end semiconductor manufacturing, a sector dominated by Taiwan, South Korea and the United States.
The facility will manufacture glass substrates for chip packaging, a process that stacks multiple semiconductor components vertically to improve performance and reduce size. Union Minister for Electronics and Information Technology Ashwini Vaishnaw and Odisha Chief Minister Mohan Charan Majhi laid the foundation stone at the ceremony.
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Once operational, the plant is expected to produce 70,000 glass panels annually, along with 50 million assembled units and approximately 13,000 advanced 3D heterogeneous integration modules. Heterogeneous integration refers to combining different types of chips, such as processors, memory and sensors, into a single package.
Odisha Semiconductor Race
The state now hosts both India’s first compound semiconductor fabrication unit and the first 3D glass substrate packaging facility, according to the state government. No other Indian state currently has both categories of semiconductor manufacturing.
“For the first time in India, an advanced 3D Glass Solutions semiconductor project is being established,” Majhi said at the event. He noted that global technology firms including Intel, Lockheed Martin and Applied Materials work with similar packaging technologies.
The products manufactured at the Bhubaneswar facility will serve sectors including artificial intelligence, high-performance computing, defence electronics and telecommunications, the chief minister said.
Vaishnaw confirmed that two semiconductor projects have already been approved for Odisha under the India Semiconductor Mission, the central government’s programme to build domestic chip manufacturing capacity. Three additional electronics and semiconductor proposals are under consideration, he added.
“Discussions are also underway with major global companies, including Intel, for future investments in the state,” Vaishnaw said.
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The minister highlighted India’s progress in electronics manufacturing, stating that production in the sector has grown six-fold over the past 12 years. India became the world’s second-largest mobile phone manufacturer and emerged as the leading exporter of mobile phones in 2025, he said.
Employment Potential
The growing semiconductor presence in Odisha is expected to create employment for engineering graduates, diploma holders and Industrial Training Institute students, according to the state government. Specific job numbers were not disclosed at the event.
Majhi described the development as part of a broader shift for Odisha from a resource-based economy, historically dependent on minerals, metals and energy, towards technology-led growth.
“Odisha is ready to play a pivotal role in realising the vision of making India self-reliant in semiconductor and electronics manufacturing,” he said.
The state government and 3D Glass Solutions have not announced a timeline for when the facility will begin commercial production.
Your Questions, Answered
What is 3D chip packaging?
3D chip packaging stacks multiple semiconductor components vertically into a single unit. This improves performance, reduces size and allows different types of chips such as processors and memory to work together more efficiently.
Where is India’s first 3D chip packaging facility being built?
The facility is being built at Info Valley in Bhubaneswar, Odisha. The foundation stone was laid on 20 April 2026 by Union Minister Ashwini Vaishnaw and Chief Minister Mohan Charan Majhi.
How much is being invested in the Odisha semiconductor project?
The project by 3D Glass Solutions involves an investment of approximately ₹2,000 crore. The facility will produce 70,000 glass panels, 50 million assembled units and around 13,000 advanced 3D modules annually.
How many semiconductor projects have been approved for Odisha?
Two semiconductor projects have been approved for Odisha under the India Semiconductor Mission. Three additional electronics and semiconductor proposals are currently under consideration by the central government.